By D. A. Beck (auth.), Gerald A. Walker (eds.)
Read Online or Download Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado PDF
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Extra info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Que s ti on: You don't? Well, we had a case of beryllium pneumosis once, and it could be fatal. Answer: - I think you wUI find that beryllium parts, for probably sometime to come, unless you are wUling to go into it on a pretty extensive scale, wUI be better handled by custom machine shops-custom fabricators-like Speedring in Detroit. A large share of their business is in machining beryllium and I think you will find that right now it is cheaper to have somebody else make the ventilation setup.
49 Avg. 48 Moisture content, wt. 05 Alkalinity. meq/g Water solubility, wt. Flotation ratio. 0 35 6:1 OP 3F 1/60 23-5 RT eM 3/60 24-S eM 8/60 27-S eM 1/61 30-S eM Spec. 5 max. 20 max. Volume ratio of floters to sinkers in water. tSUrface of test specimen improved ana number of test specimens increased for greater rellsbillty starting January. 1960. tToo viscous to pour. of filler. 49 glcc, which is above that allowed by the specification. This material was rejected; it yielded castings that completely failed the thermal shock test since the mix did not contain a sufficient volume of filler.
The standard board is available in 18 in. by 18 in. nominal sheets and is supplied with Nema G 11 skins unclad or clad with 2 oz copper. id Nema G10 paper base epoxy, glassreinforced Melamine, and paper-base Melamine can also be supplied. The physical characteristics of the damped composite boards are compatible with the requirements of MIL- P-13949B. A typical comparison of test results for these boards is shown in Table II. lt is quite reasonable to conclude that no degradation of the capabilities of the board has resulted.
Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado by D. A. Beck (auth.), Gerald A. Walker (eds.)